Advancing UWB Since 2020
FiRa Plugfest #1 marks an important step forward for ultra-wideband (UWB) interoperability, and we are proud to recognize Qualcomm Technologies, Inc. as both host and a long-standing leader within the FiRa® Consortium ecosystem.
A FiRa Sponsor Member since 2020, Qualcomm Technologies has played a consistent role in advancing UWB from an emerging capability to an integrated, scalable technology. Their early and sustained investment in UWB helped accelerate industry adoption at a time when precise ranging and secure device awareness were beginning to move into mainstream products.
Today, Qualcomm Technologies integrates UWB directly into select Snapdragon® mobile platforms, enabling centimeter-level ranging accuracy, secure out-of-band authentication, spatial awareness, and robust device-to-device communication. These capabilities help support secure digital key solutions, and highly accurate location-based services across a growing range of devices.
Engineering Precision at the Silicon Level
At the silicon level, Qualcomm Technologies designs highly integrated system-on-chips that aim to optimize power efficiency, signal processing, and radio performance. UWB performance depends on precise timing, low latency, and reliable packet exchange in complex environments. By embedding UWB within advanced Snapdragon platforms, Qualcomm Technologies helps enable device manufacturers to deliver accurate ranging and secure communication without compromising battery life or overall system performance.
Beyond smartphones, Qualcomm Technologies envisions the expansion of UWB into automotive, access control, IoT, and spatial computing applications. Secure ranging and device authentication are foundational for digital car keys, hands-free access, asset tracking, and contextual experiences. The company’s work helps ensure these use cases scale across global markets with consistent performance and strong security.
Supporting Interoperability Through Plugfest #1
That leadership extends directly into ecosystem collaboration. Plugfest #1 provides FiRa members with the opportunity to conduct pairwise interoperability testing across adopted specifications, validate implementations, and strengthen product readiness. By hosting the event in San Diego, Qualcomm Technologies is creating an environment for real-world validation and shared technical learning that strengthens the entire UWB ecosystem.
Interoperability requires engineering rigor, cross-vendor validation, and companies willing to invest in collective progress. Qualcomm Technologies has demonstrated that commitment since joining FiRa in 2020, and its role as host of Plugfest #1 reinforces its dedication to advancing secure, scalable UWB deployments worldwide.
Learn more about FiRa Plugfests and how they support UWB interoperability. Ready to participate? Register now for Plugfest #1 in San Diego and join us in advancing the next phase of UWB innovation.
Snapdragon is a product of Qualcomm Technologies, Inc. and/or its subsidiaries.