Our carefully selected management team is committed to the idea that the strength of an organization is reflected by the quality of its people.
Charlie Zhang, Board ChairVice President, Engineering, Samsung Research America
Charles Dachs, Board Vice-ChairVice President and General Manager for Secure Embedded Transactions, NXP Semiconductors
Ramesh Songukrishnasamy, Director and TreasurerSenior Vice President and CTO, HID Global
Clint Chaplin, SecretarySenior Principal Standards Engineer, Samsung Research America
Tobias Goldschalt, Board MemberSenior Connectivity Architect, Bosch
Luc Darmon, Board MemberGeneral Manager Secure Transactions, Decawave
Mark Lynn, Board MemberVice President – Americas Engineering, Allegion