Our carefully selected management team is committed to the idea that the strength of an organization is reflected by the quality of its people.
Charlie Zhang, Board Chair
Senior Vice President, Engineering, Samsung Research America
Charles Dachs, Board Vice-Chair
Vice President and General Manager for Secure Embedded Transactions, NXP Semiconductors
Ramesh Songukrishnasamy, Director and Treasurer
Senior Vice President and CTO, HID Global
Clint Chaplin, Secretary
Senior Principal Standards Engineer, Samsung Research America
Tobias Goldschalt, Board Member
Senior Connectivity Architect, Bosch
Luc Darmon, Board Member
Director, Secure Transactions BU, Qorvo (formerly Decawave)
Mark Lynn, Board Member
Vice President – Americas Engineering, Allegion