See what others are saying about the FiRa Consortium and UWB technology!
Enterprise IoT Insights - March 4, 2021
The FiRa Consortium looks to build the IoT market around the burgeoning ultra-wideband (UWB) technology.
XDA-Developers - October 13, 2020
Next Level IOT Connectivity with "Point to Connect"
Samsung Newsroom - October 12, 2020
Together with industry leaders, we are striving to accelerate UWB’s broad adoption and implementation across ecosystems.
SecurityInformed.com - September 30, 2020
Indoor positioning uses UWB technology to help locate people and things
5G Technology World - September 11, 2020
The decades-old technology takes on a new life by providing location precision to 10 cm, and it operates indoors.
NFC World - August 17, 2020
Samsung has launched the first Android device to include an ultra wideband (UWB) chip.
Engadget - August 5, 2020
In the near term, it'll power Google's new Airdrop-like "Nearby Share" service.
Enterprise IoT Insights - July 8, 2020
The FiRa Consortium says UWB outperforms other short-range technologies in terms of accuracy, reliability, and power consumption – “by a wide margin”.
COMPUTERWORLD - December 31, 2019
Ultra Wideband and IoT devices hold the promise of more precise location services as well as secure access to a myriad of systems.
Security Industry Group - September 18, 2019
The demonstration of Ultra-Wideband (UWB) at their booth, in collaboration with fellow FiRa members Samsung and NXP, was quite impressive and illustrative of the potential of this technology.
Forbes - August 1, 2019
Ultra-Wideband or UWB was originally specified as a technology for high data rate communication but it achieved little traction due to direct competition with Wi-Fi.
Engadget - August 1, 2019
The FiRa Consortium (the name stands for 'fine ranging') includes the likes of Samsung, Bosch, Sony and LitePoint, and they're all committed to growing the UWB ecosystem.
EE|Times - August 1, 2019
A new consortium has launched to drive ultra-wideband (UWB) technology for accurate fine ranging applications, and to ensure interoperability across the ecosystem of chipset, device and service infrastructure through standards and certifications.