Press Releases
Xiaomi, DENSO, Huf Group, Hyundai, MinebeaMitsumi, and Tile Support the Growth of the FiRa Consortium
December 16, 2019
The FiRa Consortium, a catalyst for bringing leading innovators together to drive UWB expansion forward, today announced growth of its’ member network.Key Industry Players The ASSA ABLOY Group, HID, NXP, Samsung, Bosch, Sony, LitePoint and TTA Establish FiRa Consortium to Drive Seamless User Experiences Using Ultra-Wideband Technology
August 1, 2019
FiRa Consortium Ensures an Interoperable UWB Ecosystem Across Chipset, Device and Service Infrastructure Through Standards and Certifications
FiRa Consortium In the News
See what others are saying about the FiRa Consortium and UWB technology!
GSX 2019 Report: Security innovation and trends (Part I)
Security Industry Group - September 18, 2019
The demonstration of Ultra-Wideband (UWB) at their booth, in collaboration with fellow FiRa members Samsung and NXP, was quite impressive and illustrative of the potential of this technology.
Sony and Samsung resurrect ultra-wideband to improve location tracking
Engadget - August 1, 2019
The FiRa Consortium (the name stands for 'fine ranging') includes the likes of Samsung, Bosch, Sony and LitePoint, and they're all committed to growing the UWB ecosystem.
FiRa Consortium Aims to Revive UWB, Drive Interoperability
EE|Times - August 1, 2019
A new consortium has launched to drive ultra-wideband (UWB) technology for accurate fine ranging applications, and to ensure interoperability across the ecosystem of chipset, device and service infrastructure through standards and certifications.
Group formed to promote UWB
Electronics Weekly - August 1, 2019
The ASSA ABLOY Group which includes HID Global, and NXP Semiconductors, Samsung Electronics, and Bosch have launched the FiRa Consortium.
Ultra-Wideband (UWB) Gains Traction As A Sensing Technology Under New Industry Consortium
Forbes - August 1, 2019
Ultra-Wideband or UWB was originally specified as a technology for high data rate communication but it achieved little traction due to direct competition with Wi-Fi.
Upcoming FiRa Consortium Events
DOCOMO Open House 2020
Visit us in the ”Osaifu-keitai supports hands-free features” booth (Presented by Sony and NTT DOCOMO)
January 23, 2020 - January 24, 2020
Tokyo Big Sight, Tokyo, Japan
Fraunhofer SIT ID:SMART Workshop
Attend this workshop to hear Hans-Juergen Pirch (HID Global) and Frank Leong (NXP) give a presentation titled “Introduction to Impulse Radio UWB Seamless Access Systems”.
February 19, 2020 - February 20, 2020
Darmstadt, Germany
Upcoming FiRa Consortium Members’ Meetings
Meeting in San Jose, CA
February 10, 2020 - February 13, 2020
San Jose, California, United States
Meeting in Incheon, Korea
April 20, 2020 - April 23, 2020
Incheon, South Korea
Meeting in Stuttgart, Germany
June 2, 2020 - June 5, 2020
Stuttgart, Germany